Comprehensive Package Assembly Solutions for High-Reliability Applications

Packaging and Electronic Assembly

A full array of IC packaging services from wafer dicing to assembly of GaAs / GaN RF modules and high-temperature Multi-chip Modules. In support of our defense customers, we are an ITAR-registered facility, accredited Trusted Supplier, and DLA MIL-PRF-38535 certified assembly manufacturer. Our Class 100 clean rooms provide the ultimate environment in particulate-free assembly and ESD protection.

Wafer Dicing Services

We also handle cutting materials such as quartz and sapphire. Wafer production services include dicing of up to 8-inch wafers. Our wafer production facility is capable of handling small and large quantities of wafers and substrates.