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Microelectronics 

From design and qualification to package assembly, component upscreening and tape-and-reel, MPG supports RF and mixed-signal microelectronics for demanding space, defense and aerospace applications.

If you arrived here from a Criteria Labs link, Criteria Labs was acquired by MPG.

Space-Qualified Reliability

MIL-PRF-38534/38535 Class K, MIL-STD-883, NASA INST-0002 & ESA upscreening.

Controlled Clean-Room Processing

Class 100 clean room supporting high-volume hermetic and non-hermetic packaging.

Dedicated U.S. Tape and Reel Facility

15,000-square-foot Penrose, CO facility — custom tooling and high-volume SMT tape and reel production.

Fast Turnaround

24–48 hour die tape and reel; prototype assembly and packaging in as little as 8 weeks.

Integrated Design-to-Delivery Support

Engineering, packaging, qualification and production services coordinated through a single partner.

Services

Contact us for an individual process or coordinated support from design through delivery.

TapeReel
  • Surface mount device
  • De-tape
  • Manual defect inspection to six sides
  • Trays, tubes, waffle packs, thermoformed trays, bulk, wafers, etc.
  • Tape to tray, tape to tube, tape to waffle pack, tape to bulk
  • Standard and Customizable Bar-code labeling
  • 2D, 3D, and manual inspection
  • Tray or tube bake
  • Kapton tape
  • Heat seal or PSA
  • Cobalt dichloride/Cobalt dichloride Free HIC’s Dry-Pack
  • Clay desiccant
  • 2D, 3D, and manual inspection
  • Tray or tube bake
  • Kapton tape
  • Large inventory of carrier tape
  • Automated or manual placement
  • Recover
  • Custom designed carrier tape for your unique applications
  • Tray to tray scan
  • Capacitance or resistance testing
  • Tube to tube scan
  • SOIC’s
  • PLCC’s
  • Battery holders
  • TSSOP’s
  • SOJ’s
  • Chip Resistors
  • TSOP’s
  • SOMC’s
  • Washers
  • MSOP’s
  • SSOP’s
  • Standoffs
  • QFP’s
  • VSOP’s
  • Machined parts
  • BGA’s
  • QSOP’s
  • SOT, 3,4,5,6 Leads
  • uBGA’s
  • QVSOP’s
  • EZ-PCB Sockets
  • FBGA’s
  • DDPAK
  • SMT Jumper Links
  • QFN’s
  • DPAK
  • RFI Shield Fingers or Grounding Contacts
  • DFN’s
  • TO263
  • SMD trimmers
  • FPAKMIJ’s
  • Spring-loaded pins
  • Power Inductors
  • Test Points
  • Connectors
  • Transceivers
  • Solider Performs
  • RF Shielding
  • Dip Switches
  • Medical Device outer casing
  • Fasteners
  • MOSFET
  • LED’s
  • Jumper Wires
  • Terminal Blocks
  • RFI Shield Clips
  • Pins
  • Screws
  • SMT Test Points
  • Switch
  • Board mount transformers
  • SMT Coin Cell Battery Holders
  • SMD Antennas
  • Oscillators
  • PLCC Sockets
  • GPS Receivers
  • Potentiometer
  • Ceramic Resonator
  • Lithium Batteries
  • Chip Capacitors
  • Fresnel Lens-Solar Industry
  • Test Points
Design

Design

Turnkey microelectronics design to customer specifications, including RF module design, electromagnetic simulation, substrate layout, flip-chip integration, and MCM/SiP chip-and-wire solutions.

Qualification

Qualification

Design and package qualification support for high-reliability applications, including custom burn-in boards, test boards and carriers for high-temperature aging and electrical testing.

Assembly

Package Assembly

Microelectronics packaging services from wafer dicing and die attach through assembly of GaAs/GaN RF modules, hybrids and high-temperature multi-chip modules.

Upscreening

Upscreening

Component upscreening for high-reliability space, defense, missile and radar applications. MPG develops and executes screening flows based on program requirements, applicable standards, and component risk.

Explore Our Products

GainBlockV2

Gain Blocks

RF gain-block amplifiers for signal-chain applications, with standard and custom configurations available for qualified requirements.

GaN Power Amplifiers

GaN Power Amplifiers

Custom GaN power-amplifier design and integration for high-power, high-efficiency RF applications.

MCMsHybrids

MCMs & Hybrids

Custom multi-chip modules and hybrid microcircuits designed, assembled and prepared for high-reliability space and defense requirements.

Part#

Technology

Package

F Low (MHz)

F High (MHz)

Gain (dB)

NF (dB)

OP1 (dBm)

OIP3 (dBm)

Vcc (V)

Icc (ma)

CL-1010

InGap HBT

SMT2

10

6000

15.5

4.5

19

38

5

80

CL-1012

InGap HBT

SMT2

10

6000

20

3.7

18.2

35

5

71

CL-1014

E-pHEMT

SMT2

30

2000

21

1

23.9

37.4

5

141

CL-1016

pHEMT

SMT2

500

8000

21

1.2

19.6

30.5

5

60

CL-1018

pHEMT

SMT2

10

10000

19.5

1.1

21

33

5

65

CL-1020

InGap HBT

SMT2

10

6000

19.3

3.9

18.2

29

5

93

CL-1024

EpHEMT

SMT2

50

4000

18.4

0.8

19

34

5

58

CL-1026

InGap HBT

SMT2

10

12000

16.7

3.9

15.9

29.1

5

48

CL-1028

InGap HBT

SMT2

0

7000

16

5.5

21

35.8

5

108

CL-1034

InGap HBT

SMT2

0

10000

15

4

13

25

5

50

CL-1038

InGap HBT

SMT2

0

10000

14

4.5

13

24

5

56

CL-1046

E-pHEMT

SMT2

50

4000

11.3

0.8

22.3

41.6

5

97

CL-1056

E-pHEMT

SMT2

30

2000

19.7

1

18.8

30.9

3

72

CL-1058

E-pHEMT

SMT2

50

4000

17.6

0.8

16.4

28.5

3

33

CL-1060

CL-1064

E-pHEMT

SMT2

50

1500

15.2

4

25.8

45

9

182

CL-1066

E-pHEMT

SMT2

30

2000

21.3

1.2

28.4

44.4

8

235

CL-1068

pHEMT

SMT2

500

8000

21.9

1.2

21.2

36.8

6

77

CL-1070

Part#

Technology

Package

F Low (MHz)

F High (MHz)

Gain (dB)

Pout (W)

PAE (%)

OIP3 (dBm)

Vcc (V)

Icc (ma)

CL-1210

GaN

7x7 QFN

27000

31000

25

5

25

N/A

20

140

Part#

Technology

Package

F Low (MHz)

F High (MHz)

Gain (dB)

NF (dB)

Pout (W)

OIP3 (dBm)

Vcc (V)

Icc (ma)

CL-3010

Limiter + LNA

7x7 QFN

4000

20000

17

2

N/A

28

100

5

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Microwave Products Group
13033 Trautwein Road
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support@mpgdover.com

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